JPH048781B2 - - Google Patents
Info
- Publication number
- JPH048781B2 JPH048781B2 JP1186193A JP18619389A JPH048781B2 JP H048781 B2 JPH048781 B2 JP H048781B2 JP 1186193 A JP1186193 A JP 1186193A JP 18619389 A JP18619389 A JP 18619389A JP H048781 B2 JPH048781 B2 JP H048781B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- mixture
- sulfonic acid
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 claims abstract description 31
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 9
- -1 naphthoquinonediazide sulfonic acid ester Chemical class 0.000 claims description 30
- 150000001875 compounds Chemical class 0.000 claims description 20
- 239000000047 product Substances 0.000 claims description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 17
- 229920003986 novolac Polymers 0.000 claims description 15
- 239000007859 condensation product Substances 0.000 claims description 6
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 229940079877 pyrogallol Drugs 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229910005965 SO 2 Inorganic materials 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 238000007639 printing Methods 0.000 abstract description 26
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 18
- 239000007795 chemical reaction product Substances 0.000 abstract description 12
- 150000002148 esters Chemical class 0.000 abstract description 9
- 239000002253 acid Substances 0.000 abstract description 5
- 239000012670 alkaline solution Substances 0.000 abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 4
- 239000011230 binding agent Substances 0.000 abstract description 3
- 239000002360 explosive Substances 0.000 abstract description 3
- 150000003384 small molecules Chemical class 0.000 abstract description 3
- 150000004820 halides Chemical class 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 25
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 239000010410 layer Substances 0.000 description 13
- 150000002989 phenols Chemical class 0.000 description 12
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical class [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 9
- 229920001568 phenolic resin Polymers 0.000 description 9
- 239000005011 phenolic resin Substances 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 7
- 238000005886 esterification reaction Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- DUAJIKVIRGATIW-UHFFFAOYSA-N trinitrogen(.) Chemical compound [N]=[N+]=[N-] DUAJIKVIRGATIW-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 5
- 229940118056 cresol / formaldehyde Drugs 0.000 description 5
- 230000032050 esterification Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- HAGVXVSNIARVIZ-UHFFFAOYSA-N 4-chlorosulfonyl-2-diazonionaphthalen-1-olate Chemical compound C1=CC=C2C([O-])=C([N+]#N)C=C(S(Cl)(=O)=O)C2=C1 HAGVXVSNIARVIZ-UHFFFAOYSA-N 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000003461 sulfonyl halides Chemical class 0.000 description 3
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 2
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- ZGEVJWAATSHAKG-UHFFFAOYSA-N (3,5-dibromo-2,4-dihydroxyphenyl)-phenylmethanone Chemical compound OC1=C(Br)C(O)=C(Br)C=C1C(=O)C1=CC=CC=C1 ZGEVJWAATSHAKG-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229940105324 1,2-naphthoquinone Drugs 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- KJXKCDVQERWFTP-UHFFFAOYSA-N 4,6-bis[(2,4-dihydroxyphenyl)sulfanyl]benzene-1,3-diol Chemical compound OC1=CC(O)=CC=C1SC1=CC(SC=2C(=CC(O)=CC=2)O)=C(O)C=C1O KJXKCDVQERWFTP-UHFFFAOYSA-N 0.000 description 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ALVGSDOIXRPZFH-UHFFFAOYSA-N [(1-diazonioimino-3,4-dioxonaphthalen-2-ylidene)hydrazinylidene]azanide Chemical compound C1=CC=C2C(=N[N+]#N)C(=NN=[N-])C(=O)C(=O)C2=C1 ALVGSDOIXRPZFH-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910000288 alkali metal carbonate Inorganic materials 0.000 description 1
- 150000008041 alkali metal carbonates Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 125000002128 sulfonyl halide group Chemical group 0.000 description 1
- 150000003510 tertiary aliphatic amines Chemical class 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Materials For Photolithography (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813100077 DE3100077A1 (de) | 1981-01-03 | 1981-01-03 | Lichtempfindliches gemisch, das einen naphthochinondiazidsulfonsaeureester enthaelt, und verfahren zur herstellung des naphthochinondiazidsulfonsaeureesters |
| DE3100077.0 | 1981-01-03 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56216083A Division JPS57135947A (en) | 1981-01-03 | 1981-12-28 | Manufacture of photosensitive mixture and naphthoquinone deazidosulfonic ester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02197844A JPH02197844A (ja) | 1990-08-06 |
| JPH048781B2 true JPH048781B2 (en]) | 1992-02-18 |
Family
ID=6122201
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56216083A Granted JPS57135947A (en) | 1981-01-03 | 1981-12-28 | Manufacture of photosensitive mixture and naphthoquinone deazidosulfonic ester |
| JP1186193A Granted JPH02197844A (ja) | 1981-01-03 | 1989-07-20 | ナフトキノンジアジドスルホン酸エステルの製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56216083A Granted JPS57135947A (en) | 1981-01-03 | 1981-12-28 | Manufacture of photosensitive mixture and naphthoquinone deazidosulfonic ester |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US4424270A (en]) |
| EP (1) | EP0055814B2 (en]) |
| JP (2) | JPS57135947A (en]) |
| AT (1) | ATE18469T1 (en]) |
| AU (1) | AU546108B2 (en]) |
| BR (1) | BR8108552A (en]) |
| CA (1) | CA1186439A (en]) |
| DE (2) | DE3100077A1 (en]) |
| ZA (1) | ZA818803B (en]) |
Families Citing this family (92)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3246106A1 (de) * | 1982-12-13 | 1984-06-14 | Hoechst Ag, 6230 Frankfurt | Lichtempfindliches gemisch, daraus hergestelltes lichtempfindliches kopiermaterial und verfahren zur herstellung einer druckform aus dem kopiermaterial |
| JPS59182444A (ja) * | 1983-04-01 | 1984-10-17 | Sumitomo Chem Co Ltd | ポジ型フオトレジストの改良現像液 |
| JPS60121445A (ja) * | 1983-12-06 | 1985-06-28 | Japan Synthetic Rubber Co Ltd | 集積回路作製用ポジ型感光性樹脂組成物 |
| US5256522A (en) * | 1985-08-12 | 1993-10-26 | Hoechst Celanese Corporation | Image reversal negative working O-naphthoquinone diazide and cross-linking compound containing photoresist process with thermal curing |
| US5217840A (en) * | 1985-08-12 | 1993-06-08 | Hoechst Celanese Corporation | Image reversal negative working o-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment and element produced therefrom |
| JPH0654381B2 (ja) * | 1985-12-24 | 1994-07-20 | 日本合成ゴム株式会社 | 集積回路作製用ポジ型レジスト |
| EP0227487B1 (en) * | 1985-12-27 | 1992-07-15 | Japan Synthetic Rubber Co., Ltd. | Positive type radiation-sensitive resin composition |
| US4732837A (en) * | 1986-05-02 | 1988-03-22 | Hoechst Celanese Corporation | Novel mixed ester O-quinone photosensitizers |
| US4732836A (en) * | 1986-05-02 | 1988-03-22 | Hoechst Celanese Corporation | Novel mixed ester O-quinone photosensitizers |
| US5035976A (en) * | 1986-05-02 | 1991-07-30 | Hoechst Celanese Corporation | Photosensitive article having phenolic photosensitizers containing quinone diazide and acid halide substituents |
| US5162510A (en) * | 1986-05-02 | 1992-11-10 | Hoechst Celanese Corporation | Process for the preparation of photosensitive compositions containing a mixed ester o-quinone photosensitizer |
| US4902785A (en) * | 1986-05-02 | 1990-02-20 | Hoechst Celanese Corporation | Phenolic photosensitizers containing quinone diazide and acidic halide substituents |
| DE3629122A1 (de) * | 1986-08-27 | 1988-03-10 | Hoechst Ag | Verfahren zur herstellung eines o-naphthochinondiazidsulfonsaeureesters und diesen enthaltendes lichtempfindliches gemisch |
| JPS63178228A (ja) * | 1987-01-20 | 1988-07-22 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
| DE3718416A1 (de) * | 1987-06-02 | 1988-12-15 | Hoechst Ag | Lichtempfindliches gemisch auf basis von 1,2-naphthochinondiaziden, daraus hergestelltes aufzeichnungsmaterial und dessen verwendung |
| DE3729034A1 (de) * | 1987-08-31 | 1989-03-09 | Hoechst Ag | Lichtempfindliches gemisch auf basis von 1,2-naphthochinondiaziden und hiermit hergestelltes lichtempfindliches kopiermaterial |
| JP2568867B2 (ja) * | 1987-12-04 | 1997-01-08 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
| JP2552891B2 (ja) * | 1988-01-26 | 1996-11-13 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
| JP2706978B2 (ja) * | 1988-05-07 | 1998-01-28 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
| JP2629814B2 (ja) * | 1988-05-09 | 1997-07-16 | 日本合成ゴム株式会社 | ポジ型感放射線性樹脂組成物 |
| US5254440A (en) * | 1988-05-31 | 1993-10-19 | Ocg Microelectronic Materials, Inc. | Selected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositions and processes of forming resist images |
| US5239122A (en) * | 1988-05-31 | 1993-08-24 | Ocg Microelectronic Materials, Inc. | Selected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositions |
| US5177172A (en) * | 1988-05-31 | 1993-01-05 | Ocg Microelectronic Materials, Inc. | Selected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositions |
| US5002851A (en) * | 1988-05-31 | 1991-03-26 | Olin Hunt Specialty Products, Inc. | Light sensitive composition with o-quinone diazide and phenolic novolak resin made using methylol substituted trihydroxybenzophenone as reactant |
| DE3822522A1 (de) * | 1988-07-04 | 1990-03-22 | Hoechst Ag | 1,2-naphthochinon-2-diazid-sulfonsaeureamide und lichtempfindliche gemische, die diese enthalten |
| JP2800186B2 (ja) * | 1988-07-07 | 1998-09-21 | 住友化学工業株式会社 | 集積回路製作用ポジ型レジスト組成物の製造方法 |
| JP2636348B2 (ja) * | 1988-07-20 | 1997-07-30 | 住友化学工業株式会社 | ポジ型レジスト用組成物 |
| SG48028A1 (en) * | 1988-08-10 | 1998-04-17 | Hoechst Celanese Corp | Light-sensitive novolac resins |
| JP2715480B2 (ja) * | 1988-10-13 | 1998-02-18 | 住友化学工業株式会社 | ポジ型レジスト用組成物 |
| DE3836586A1 (de) * | 1988-10-27 | 1990-05-03 | Ciba Geigy Ag | Phlegmatisierte chinondiazid-verbindungen |
| JPH0816779B2 (ja) * | 1988-12-02 | 1996-02-21 | 富士写真フイルム株式会社 | 新規な感光性化合物及びそれを用いたフオトレジストの形成方法 |
| JP2697039B2 (ja) * | 1988-12-06 | 1998-01-14 | 住友化学工業株式会社 | ポジ型レジスト組成物の製造方法 |
| EP0384892A1 (de) * | 1989-02-23 | 1990-08-29 | Ciba-Geigy Ag | Photoresist-Zusammensetzungen |
| US5200293A (en) * | 1989-02-23 | 1993-04-06 | Ciba-Geigy Corporation | Photoresist composition containing specific amounts of a naphthoquinone diazide sulfonyl ester of tetrahydroxy diphenyl sulfide and a polyhydroxy compound |
| JPH02245754A (ja) * | 1989-03-17 | 1990-10-01 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
| JP2700918B2 (ja) * | 1989-04-26 | 1998-01-21 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
| JPH02296247A (ja) * | 1989-05-11 | 1990-12-06 | Nippon Zeon Co Ltd | ボジ型レジスト組成物 |
| US5196289A (en) * | 1989-09-07 | 1993-03-23 | Ocg Microelectronic Materials, Inc. | Selected block phenolic oligomers and their use in radiation-sensitive resist compositions |
| US5188921A (en) * | 1989-09-07 | 1993-02-23 | Ocg Microelectronic Materials, Inc. | Selected block copolymer novolak binder resins in radiation-sensitive resist compositions |
| US5234795A (en) * | 1989-09-07 | 1993-08-10 | Ocg Microelectronic Materials, Inc. | Process of developing an image-wise exposed resist-coated substrate |
| WO1991004512A1 (en) * | 1989-09-07 | 1991-04-04 | Ocg Microelectronic Materials, Inc. | Selected block copolymer novolak binder resins and their use in radiation-sensitive compositions |
| US5232819A (en) * | 1989-09-07 | 1993-08-03 | Ocg Microelectronic Materials, Inc. | Selected block phenolic oligomers and their use in phenolic resin compositions and in radiation-sensitive resist compositions |
| KR0184870B1 (ko) * | 1990-02-20 | 1999-04-01 | 아사구라 다기오 | 감방사선성 수지 조성물 |
| DE69129955T2 (de) * | 1990-05-02 | 1998-12-24 | Mitsubishi Chemical Corp., Tokio/Tokyo | Photolackzusammensetzung |
| US5145763A (en) * | 1990-06-29 | 1992-09-08 | Ocg Microelectronic Materials, Inc. | Positive photoresist composition |
| US5260162A (en) * | 1990-12-17 | 1993-11-09 | Khanna Dinesh N | Photosensitizer compositions containing diazo fluorinated esters of hexafluoro-bis-phenols or bis-hexafluoroethers |
| DE4111445A1 (de) * | 1991-04-09 | 1992-10-15 | Hoechst Ag | Strahlungsempfindliches gemisch mit estern der 1,2-naphthochinon-2-diazid-sulfonsaeure und ein damit hergestelltes strahlungsempfindliches aufzeichnungsmaterial |
| US5306594A (en) * | 1991-11-04 | 1994-04-26 | Ocg Microelectronic Materials, Inc. | Radiation-sensitive compositions using novolak resins made from a substituted bis(hydroxyphenyl)methane and a bis-(methylol)-cresol |
| DE4209343A1 (de) * | 1992-03-23 | 1993-09-30 | Hoechst Ag | 1,2-Naphthochinon-2-diazid-sulfonsäureester, damit hergestelltes strahlungsempfindliches Gemisch und strahlungsempfindliches Aufzeichnungsmaterial |
| DE4219544A1 (de) * | 1992-05-06 | 1993-11-11 | Hoechst Ag | Verfahren zur Phlegmatisierung von 1,2-Naphthochinon-2-diazid-sulfonsäureestern |
| US5413894A (en) * | 1993-05-07 | 1995-05-09 | Ocg Microelectronic Materials, Inc. | High ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositions |
| KR100305333B1 (ko) * | 1993-10-28 | 2001-11-22 | 마티네즈 길러모 | 감광성수지조성물및이를사용한패턴의형성방법 |
| GB9326150D0 (en) * | 1993-12-22 | 1994-02-23 | Alcan Int Ltd | Electrochemical roughening method |
| US5529880A (en) * | 1995-03-29 | 1996-06-25 | Shipley Company, L.L.C. | Photoresist with a mixture of a photosensitive esterified resin and an o-naphthoquinone diazide compound |
| DE69604114T2 (de) * | 1995-04-10 | 2000-03-02 | Shipley Co., L.L.C. | Gemische von photoaktiven Zusammensetzungen enthaltendes Fotoresist |
| JP2790132B2 (ja) * | 1996-10-18 | 1998-08-27 | 住友化学工業株式会社 | 集積回路製作用ポジ型レジストパターンの形成方法 |
| JP3105459B2 (ja) * | 1996-10-31 | 2000-10-30 | 東京応化工業株式会社 | ポジ型ホトレジスト組成物およびこれを用いた多層レジスト材料 |
| IT1299220B1 (it) | 1998-05-12 | 2000-02-29 | Lastra Spa | Composizione sensibile sia a radiazioni ir che a radiazioni uv e lastra litografica |
| KR100363695B1 (ko) * | 1998-12-31 | 2003-04-11 | 주식회사 하이닉스반도체 | 유기난반사방지중합체및그의제조방법 |
| KR100310252B1 (ko) | 1999-06-22 | 2001-11-14 | 박종섭 | 유기 반사방지 중합체 및 그의 제조방법 |
| KR100327576B1 (ko) * | 1999-06-26 | 2002-03-14 | 박종섭 | 193ｎｍ ＡｒＦ광을 이용한 초미세 패턴 형성 공정에서 반사방지막으로 사용할 수 있는 유기 반사방지 중합체 및 그의 제조방법 |
| KR100400243B1 (ko) | 1999-06-26 | 2003-10-01 | 주식회사 하이닉스반도체 | 유기 반사방지 중합체 및 그의 제조방법 |
| KR100574482B1 (ko) | 1999-09-07 | 2006-04-27 | 주식회사 하이닉스반도체 | 유기 난반사 방지막용 조성물과 이의 제조방법 |
| KR100533379B1 (ko) | 1999-09-07 | 2005-12-06 | 주식회사 하이닉스반도체 | 유기 난반사 방지막용 조성물과 이의 제조방법 |
| KR100427440B1 (ko) | 1999-12-23 | 2004-04-17 | 주식회사 하이닉스반도체 | 유기 반사방지 화합물 및 그의 제조방법 |
| KR100355604B1 (ko) | 1999-12-23 | 2002-10-12 | 주식회사 하이닉스반도체 | 난반사 방지막용 중합체와 그 제조방법 |
| KR100359862B1 (ko) | 1999-12-23 | 2002-11-09 | 주식회사 하이닉스반도체 | 난반사 방지막용 중합체와 그 제조방법 |
| KR100549574B1 (ko) | 1999-12-30 | 2006-02-08 | 주식회사 하이닉스반도체 | 유기 반사 방지막용 중합체 및 그의 제조방법 |
| KR100687851B1 (ko) | 2000-06-30 | 2007-02-27 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
| KR100687850B1 (ko) | 2000-06-30 | 2007-02-27 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
| KR100721181B1 (ko) | 2000-06-30 | 2007-05-23 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
| KR100574486B1 (ko) | 2000-06-30 | 2006-04-27 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
| KR100721182B1 (ko) | 2000-06-30 | 2007-05-23 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
| KR100419962B1 (ko) * | 2001-03-07 | 2004-03-03 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
| US6520384B2 (en) * | 2001-04-30 | 2003-02-18 | Ketan C. Mehta | Apparatus and method for nasal rinse |
| KR100465866B1 (ko) * | 2001-10-26 | 2005-01-13 | 주식회사 하이닉스반도체 | 유기반사방지막 조성물 및 그의 제조방법 |
| FR2944281B1 (fr) * | 2009-04-08 | 2011-07-29 | Fabre Pierre Dermo Cosmetique | Derives soufres de resorcinol, leur preparation et leurs utilisations cosmetiques |
| US8486029B2 (en) * | 2009-12-16 | 2013-07-16 | Water Pik, Inc. | Pot for sinus cavity rinse |
| USD653953S1 (en) | 2009-12-16 | 2012-02-14 | Water Pik, Inc. | Squeeze bottle |
| USD627458S1 (en) | 2009-12-16 | 2010-11-16 | Water Pik, Inc. | Vessel for sinus cavity rinse |
| US8888752B2 (en) * | 2009-12-16 | 2014-11-18 | Water Pik, Inc. | Bottle for sinus cavity rinse |
| USD676126S1 (en) | 2010-06-25 | 2013-02-12 | Water Pik, Inc. | Faceted nasal seal |
| US8991660B2 (en) * | 2009-12-16 | 2015-03-31 | Water Pik, Inc. | Squeeze bottle for sinus cavity rinse |
| US9061096B2 (en) | 2009-12-16 | 2015-06-23 | Water Pik, Inc. | Powered irrigator for sinus cavity rinse |
| USD634631S1 (en) | 2009-12-16 | 2011-03-22 | Water Pik, Inc. | Nozzle and collar |
| USD676125S1 (en) | 2010-06-25 | 2013-02-12 | Water Pik, Inc. | Faceted nasal seal with bottom rim |
| USD634630S1 (en) | 2009-12-16 | 2011-03-22 | Water Pik, Inc. | Nozzle |
| USD630314S1 (en) | 2009-12-16 | 2011-01-04 | Water Pik, Inc. | Vessel with handle for sinus cavity rinse |
| USD629884S1 (en) | 2009-12-16 | 2010-12-28 | Water Pik, Inc. | Powered irrigator for sinus cavity rinse |
| US8409152B2 (en) | 2010-06-25 | 2013-04-02 | Water Pik, Inc. | Faceted nasal seal |
| TWI556958B (zh) * | 2010-09-14 | 2016-11-11 | 東京應化工業股份有限公司 | 基質劑及含嵌段共聚物之層的圖型形成方法 |
| USD670373S1 (en) | 2010-12-16 | 2012-11-06 | Water Pik, Inc. | Powered irrigator for sinus cavity rinse |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE508815A (en]) * | 1949-07-23 | |||
| BE506677A (en]) | 1950-10-31 | |||
| GB1113759A (en) | 1965-12-17 | 1968-05-15 | Fuji Photo Film Co Ltd | Lithographic printing plates |
| US3857896A (en) | 1967-09-13 | 1974-12-31 | R Desjarlais | Substituted diresorcyl sulfide and sulfoxide compounds |
| US3647443A (en) | 1969-09-12 | 1972-03-07 | Eastman Kodak Co | Light-sensitive quinone diazide polymers and polymer compositions |
| JPS505084B1 (en]) | 1970-09-16 | 1975-02-28 | ||
| DE2331377C2 (de) | 1973-06-20 | 1982-10-14 | Hoechst Ag, 6000 Frankfurt | Lichtempfindliches Kopiermaterial |
| JPS5280022A (en) * | 1975-12-26 | 1977-07-05 | Fuji Photo Film Co Ltd | Light solubilizable composition |
| DE2847878A1 (de) * | 1978-11-04 | 1980-05-22 | Hoechst Ag | Lichtempfindliches gemisch |
| US4308368A (en) * | 1979-03-16 | 1981-12-29 | Daicel Chemical Industries Ltd. | Photosensitive compositions with reaction product of novolak co-condensate with o-quinone diazide |
-
1981
- 1981-01-03 DE DE19813100077 patent/DE3100077A1/de not_active Withdrawn
- 1981-10-27 EP EP81109002A patent/EP0055814B2/de not_active Expired
- 1981-10-27 DE DE8181109002T patent/DE3173996D1/de not_active Expired
- 1981-10-27 AT AT81109002T patent/ATE18469T1/de not_active IP Right Cessation
- 1981-12-21 ZA ZA818803A patent/ZA818803B/xx unknown
- 1981-12-21 CA CA000392803A patent/CA1186439A/en not_active Expired
- 1981-12-22 US US06/333,338 patent/US4424270A/en not_active Expired - Lifetime
- 1981-12-24 AU AU78879/81A patent/AU546108B2/en not_active Ceased
- 1981-12-28 JP JP56216083A patent/JPS57135947A/ja active Granted
- 1981-12-30 BR BR8108552A patent/BR8108552A/pt unknown
-
1983
- 1983-10-14 US US06/542,173 patent/US4555469A/en not_active Expired - Fee Related
-
1989
- 1989-07-20 JP JP1186193A patent/JPH02197844A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| AU7887981A (en) | 1982-07-15 |
| AU546108B2 (en) | 1985-08-15 |
| DE3100077A1 (de) | 1982-08-05 |
| EP0055814A3 (en) | 1983-05-25 |
| EP0055814B1 (de) | 1986-03-05 |
| EP0055814A2 (de) | 1982-07-14 |
| EP0055814B2 (de) | 1989-05-17 |
| JPS57135947A (en) | 1982-08-21 |
| JPH021296B2 (en]) | 1990-01-11 |
| ZA818803B (en) | 1982-11-24 |
| CA1186439A (en) | 1985-04-30 |
| US4555469A (en) | 1985-11-26 |
| JPH02197844A (ja) | 1990-08-06 |
| BR8108552A (pt) | 1982-10-19 |
| ATE18469T1 (de) | 1986-03-15 |
| US4424270A (en) | 1984-01-03 |
| DE3173996D1 (en) | 1986-04-10 |
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